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Multilayer PCB(2~20 Layers)

Quick Turn Multi-layer, Multilayer PCB Manufacturer 4 Layers PCB, 6 Layers PCB, 8 Layers PCB, 10 Layers PCB, 12 Layers PCB, 14 Layers PCB, 16 Layers PCB, 18 Layers PCB, 20 Layers PCB


 》Highlights (4~8 Day QTA sample,10~15 Day Mass production first lot.)  
  • Quick Turn Multi-layer PCBs(FR4), China Multilayer PCB Manufacturer and Multilayer PCB Supplier
  • Girata rapida fornitore a più strati del PWB a più strati di PCBs (FR4), della Cina e fornitore a più strati del PWB
  • Volta rápida fabricante Multilayer do PWB Multi-layer de PCBs (FR4), de China e fornecedor Multilayer do PWB
  • Schnelle Umdrehung mehrschichtiges PCBs (FR4), China mehrschichtiger PWB Hersteller und mehrschichtiger PWB Lieferant
  • Schnelle Umdrehung mehrschichtig, mehrschichtiger PWB Hersteller 4 Schichten PWB, 6 Schichten PWB, 8 Schichten PWB, 10 Schichten PWB, 12 Schichten PWB, 14 Schichten PWB, 16 Schichten PWB, 18 Schichten PWB, 20 Schichten PWB
  • Vuelta rápida de múltiples capas, fabricante de múltiples capas del PWB 4 capas del PWB, 6 capas del PWB, 8 capas del PWB, 10 capas del PWB, 12 capas del PWB, 14 capas del PWB, 16 capas del PWB, 18 capas del PWB, 20 capas del PWB
  • Tour rapide multicouche, fabricant multicouche de carte 4 couches de carte, 6 couches de carte, 8 couches de carte, 10 couches de carte, 12 couches de carte, 14 couches de carte, 16 couches de carte, 18 couches de carte, 20 couches de carte
  • Girata rapida a più strati, fornitore a più strati del PWB 4 strati del PWB, 6 strati del PWB, 8 strati del PWB, 10 strati del PWB, 12 strati del PWB, 14 strati del PWB, 16 strati del PWB, 18 strati del PWB, 20 strati del PWB
  • Volta rápida Multi-layer, fabricante Multilayer do PWB 4 camadas do PWB, 6 camadas do PWB, 8 camadas do PWB, 10 camadas do PWB, 12 camadas do PWB, 14 camadas do PWB, 16 camadas do PWB, 18 camadas do PWB, 20 camadas do PWB

  • Multilayer PCB(4 Layers)

    Power Module Material:Ceramic+FR4+Copper base Layer Coverage:4 Layers+Copper base Surface Technique:Immersion Gold Specialty:Ceramic+FR4 Multiply materials copper-clad laminate.


    Multilayer PCB(6 Layers)

    O-E Module Material: Ceramic+FR4 Layer Coverage:6 Layers Thickness:1.0 mm Surface Technique:Gold-plate +finger Specialty:Embedded Orientation


    Multilayer PCB(8 Layers)

    Embedded Systems Material:FR4 Layer Coverage:8 Layers Thickness:1.6 mm Surface Technique:HAL Line Width/Space:4mils/4mils Solder Mask Colour:Yellow.


    Multilayer PCB(10 Layers)

    DC/DC Power Module Material:Hi-Tg (170℃)、FR4 Layer Coverage:10 Layers Thickness:1.6 mm Surface Technique:Immersion Gold Specialty:Copper Weight 105 um Blind-via/Buried-via Larger Current.


    Multilayer PCB(8 Layers)

    Telecommunication base-station Material:FR4 Layer Coverage:8 Layers Thickness:2.0 mm Surface Technique:HAL Line Width/Space:4mils/4mils Specialty:BGA、Impedance Control、Shade Solder.


    Multilayer PCB(6 Layers)

    Data Collect Material:FR4 Layer Coverage:6 Layers Thickness:1.6 mm Surface:Electrolytic Au + Finger Au Weight Of Finger:30 Microinch Solder Mask Colour:blueBlind-via .


     》Detailed Account of Multilayer PCB  
  • Power Module Material:Ceramic+FR4+Copper base Layer Coverage:4 Layers+Copper base Surface Technique:Immersion Gold Specialty:Ceramic+FR4 Multiply materials copper-clad laminate.
  • O-E Module Material: Ceramic+FR4 Layer Coverage:6 Layers Thickness:1.0 mm Surface Technique:Gold-plate +finger Specialty:Embedded Orientation.
  • Embedded Systems Material:FR4 Layer Coverage:8 Layers Thickness:1.6 mm Surface Technique:HAL Line Width/Space:4mils/4mils Solder Mask Colour:Yellow.
  • DC/DC Power Module Material:Hi-Tg (170℃)、FR4 Layer Coverage:10 Layers Thickness:1.6 mm Surface Technique:Immersion Gold Specialty:Copper Weight 105 um Blind-via/Buried-via Larger Current .
  • Telecommunication base-station Material:FR4 Layer Coverage:8 Layers Thickness:2.0 mm Surface Technique:HAL Line Width/Space:4mils/4mils Specialty:BGA、Impedance Control、Shade Solder.
  • Data Collect Material:FR4 Layer Coverage:6 Layers Thickness:1.6 mm Surface:Electrolytic Au + Finger Au Weight Of Finger:30 Microinch Solder Mask Colour:blueBlind-via.



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